V. A. Bespalov, E. E. Gusev, N. A. Dyuzhev, et al., Nano-Mikrosist. Tekh. 24, 167 (2022).

Google Scholar 

A. A. Apriyana, Y. D.Lim, C. S. Tan, et al., IEEE Photonics J. 13, 1 (2021). https://doi.org/10.1109/group4.2019.8853904

Article  Google Scholar 

S. V. Tarasov, A. N. Tsotsorin, I, V. Semeikon, et al., Elektron. Mikroelektron SVCh 1, 88 (2018).

L. Yan and G. Deepak, 3D Microelectronic Packaging From Architectures to Applications (Springer Nature, 2021), p. 49.

Google Scholar 

K. D. Munck, Dissertation (2008).

F. Niklaus, G. Stemme, J.-Q. Lu, and R. J. Gutmann, J. Appl. Phys. 99, 10 (2006). https://doi.org/10.1063/1.2168512

Article  CAS  Google Scholar 

L. S. Sinev and I. D. Petrov, Steklo Keram. 73, 35 (2016).

Google Scholar 

N. A. Dyuzhev, M. A. Makhiboroda. and E. E. Gusev, Nano- Mikrosist. Tekh. 19, 30 (2017).

Google Scholar 

J. U. Knickerbocker, P. S. Andry, B. Dang, et al. IBM J. Res. Dev. 52, 553 (2008).

Article  Google Scholar 

J. Q. Lu, Proc. IEEE 97, 18 (2009).

Article  CAS  Google Scholar 

M. Koyanagi, T. Fukushima, and T. Tanaka. Proc. IEEE 97, 49 (2009).

Article  CAS  Google Scholar 

W. W.Shen and K. N. Chen, Nanoscale Res. Lett. 12, 2 (2017). https://doi.org/10.1186/s11671-017-1831-4

Article  Google Scholar 

S. Killge, V. Neumann, and J. W. Bartha, 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems (2016), p. 9. https://doi.org/10.1007/978-3-319-20481-9_2

Yu. A. Chaplygin and I. Fateev, in Proceedings of the 2020 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus) (IEEE, 2020), p. 2119.

E. E. Gusev, P. S. Ivanin, M. Yu. Fomichev, et al., Certificate of State Registration of Computer Program No. 2021613847 (2021).

M. Yu. Fomichev, M. A. Makhiboroda, N. A. Dyuzhev, et al., in Proceedings of the 2021 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus) (IEEE, 2021), p. 2558. https://doi.org/10.1109/ElConRus51938.2021.9396080

A. Jourdain, A. Schleicher, and J. Vos, in Proceedings of the 70th Electronic Components and Technology Conference, 2020, p. 42. https://doi.org/10.1109/ECTC32862.2020.00020

M. Murugesan, K. Mori, T. Kojima, and H. Hashimoto, in Proceedings of the 31st Annual SEMI Advanced Semiconductor Manufacturing Conference, 2020, p. 1. https://doi.org/10.1109/ASMC49169.2020.9185397

Q. Dinh, K. Kondo, and T. Hirato, in Proceedings of International 3D Systems Integration Conference, 2019, p. 1. https://doi.org/10.1109/3DIC48104.2019.9058846

W.-W. Shen and K.-N. Chen, Nanoscale Res. Lett. 12, 56 (2017). https://doi.org/10.1186/s11671-017-1831-4

Article  PubMed  PubMed Central  Google Scholar 

C.-T. Ko and K.-N. Chen, Microelectron. Reliab. 53, 7 (2013). https://doi.org/10.1016/j.microrel.2012.08.011

Article  CAS  Google Scholar 

J.Dukovic, S. Ramaswami, S. Pamarthy, and R. Yalamanchili, in Proceedings of IEEE International Memory Workshop, 2010, p. 1. https://doi.org/10.1109/IMW.2010.5488399

J. Bauer, O. Fursenko, S. Marschmeyer, and F. Heinrich, J. Vac. Sci. Technol. B 37, 062205 (2019). https://doi.org/10.1116/1.5120617

Article  CAS  Google Scholar 

Y.-H. Ham, D. Kim, and K.-H. Baek, Electrochem. Solid-State Lett. 15, H145 (2011). https://doi.org/10.1149/2.esl113678

Article  CAS  Google Scholar 

W. Luo, J. Zhang, Y. Li, et al., J. Mater. Sci. Mater. Electron. 27, 7 (2016). https://doi.org/27.10.1007/s10854-016-4723-y

Article  Google Scholar 

J. Zhang, Y. Ding, W. Wei, et al. Nucl. Instrum. Methods Phys. Res., Sect. A 980,164425 (2020). https://doi.org/10.1016/j.nima.2020.164425

Article  CAS  Google Scholar 

J. Gambino, T. Doan, J. Trapasso, et al. in Proceedings of Electronic Components and Technology Conference, 2013, p. 221. https://doi.org/10.1109/ECTC.2013.6575575

Y. Yan, G. Wang, H. Su, et al., in Proceedings of the 21st International Conference on Electronic Packaging Technology, 2020, p. 1. https://doi.org/10.1109/ICEPT50128.2020.9202456